Semiconductor device package and manufacturing method thereof

ABSTRACT

Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.

CROSS-REFERENCE TO RELATED APPLICATIONS/INCORPORATION BY REFERENCE

This application is a continuation of U.S. patent application Ser. No.14/698,634, filed on Apr. 28, 2015, and titled “SEMICONDUCTOR DEVICEPACKAGE AND MANUFACTURING METHOD THEREOF,” expected to issue as U.S.Pat. No. 9,966,300 on May 8, 2018, which is a continuation of U.S.patent application Ser. No. 13/678,058, filed on Nov. 15, 2012, now U.S.Pat. No. 9,136,159, and titled “METHOD AND SYSTEM FOR A SEMICONDUCTORDEVICE PACKAGE WITH A DIE-TO-PACKAGING SUBSTRATE FIRST BOND,” and acontinuation of U.S. patent application Ser. No. 13/678,046, filed onNov. 15, 2012, now U.S. Pat. No. 9,040,349, and titled “METHOD ANDSYSTEM FOR A SEMICONDUCTOR DEVICE PACKAGE WITH A DIE TO INTERPOSER WAFERFIRST BOND.” This application is also related to U.S. patent applicationSer. No. 13/678,012, filed on Nov. 15, 2012, now U.S. Pat. No.8,796,072, and titled “METHOD AND SYSTEM FOR A SEMICONDUCTOR DEVICEPACKAGE WITH A DIE-TO-DIE FIRST BOND.” The entire contents of each ofthe above-mentioned applications are hereby incorporated herein byreference in their entirety.

FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

[Not Applicable]

SEQUENCE LISTING

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MICROFICHE/COPYRIGHT REFERENCE

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FIELD OF THE INVENTION

Certain embodiments of the invention relate to semiconductor chippackaging. More specifically, certain embodiments of the inventionrelate to a method and system for a semiconductor device package with adie-to-interposer-wafer first bond. Also, certain embodiments of theinvention relate to a method and system for a semiconductor devicepackage with a die-to-packaging substrate first bond. Additionally,certain embodiments of the invention relate to a method and system for asemiconductor device package with a die-to-die first bond.

BACKGROUND OF THE INVENTION

Semiconductor packaging protects integrated circuits, or chips, fromphysical damage and external stresses. In addition, it can provide athermal conductance path to efficiently remove heat generated in a chip,and also provide electrical connections to other components such asprinted circuit boards, for example. Materials used for semiconductorpackaging typically comprises ceramic or plastic, and form-factors haveprogressed from ceramic flat packs and dual in-line packages to pin gridarrays and leadless chip carrier packages, among others.

Further limitations and disadvantages of conventional and traditionalapproaches will become apparent to one of skill in the art, throughcomparison of such systems with the present invention as set forth inthe remainder of the present application with reference to the drawings.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1A is a schematic illustrating an integrated circuit packageconfigured with a die-to-wafer first bond, in accordance with an exampleembodiment of the invention.

FIG. 1B is a schematic illustrating an integrated circuit packageconfigured with a die to interposer wafer first bond and stacked die, inaccordance with an example embodiment of the invention.

FIGS. 1C-1E illustrate example steps for bonding multiple die utilizingan adhesive film, in accordance with an example embodiment of theinvention.

FIGS. 2A-2F illustrate example steps in a die to interposer wafer firstbond structure, in accordance with an example embodiment of theinvention.

FIG. 3 is a schematic illustrating example steps in a die to interposerwafer first bond process, in accordance with an example embodiment ofthe invention.

FIG. 4 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention.

FIG. 5 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention.

FIGS. 6A-6E illustrate example steps for debonding wafers with largebackside bumps, in accordance with an example embodiment of theinvention.

FIG. 7 is a diagram illustrating die bonding utilizing a patternedunderfill layer, in accordance with an example embodiment of theinvention.

FIG. 8A is a schematic illustrating an integrated circuit packageconfigured with an interposer-to-packaging substrate first bond, inaccordance with an example embodiment of the invention.

FIG. 8B is a schematic illustrating an integrated circuit packageconfigured with an interposer-to-packaging substrate first bond andstacked die, in accordance with an example embodiment of the invention.

FIGS. 8C-8E illustrate steps for bonding multiple die utilizing anadhesive film, in accordance with an example embodiment of theinvention.

FIG. 9 is a schematic illustrating a die to packaging substrate processflow, in accordance with an example embodiment of the invention.

FIG. 10 is a schematic illustrating bonding options for die in apackage, in accordance with an example embodiment of the invention.

FIGS. 11A-11C illustrate a process for an interposer-to-packagingsubstrate first bond, in accordance with an example embodiment of theinvention.

FIG. 12 is a flow diagram illustrating an interposer fabricationprocess, in accordance with an example embodiment of the invention.

FIGS. 13A-13B illustrate initial steps in an interposer fabricationprocess, in accordance with an example embodiment of the invention.

FIGS. 13C-13D illustrate final steps in an interposer fabricationprocess, in accordance with an example embodiment of the invention.

FIG. 14 is a flow diagram illustrating a stacked die to packagingsubstrate fabrication process, in accordance with an example embodimentof the invention.

FIGS. 15A-15B illustrate initial steps in a functional die to packagesubstrate assembly process, in accordance with an example embodiment ofthe invention.

FIGS. 15C-15D illustrate final steps in a functional die to packagesubstrate assembly process, in accordance with an example embodiment ofthe invention.

FIG. 15E illustrates the resulting assembly in the die to packagesubstrate process, in accordance with an example embodiment of theinvention.

FIG. 16 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention.

FIG. 17 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention.

FIGS. 18A-18E illustrate steps for debonding wafers with large backsidebumps, in accordance with an example embodiment of the invention.

FIG. 19 is a diagram illustrating die-to-die bonding utilizing apatterned underfill layer, in accordance with an example embodiment ofthe invention.

FIG. 20A is a schematic illustrating an integrated circuit packageconfigured with a die-to-wafer first bond, in accordance with an exampleembodiment of the invention.

FIG. 20B is a schematic illustrating an integrated circuit packageconfigured with an interposer-to-wafer first bond and stacked die, inaccordance with an example embodiment of the invention.

FIGS. 20C-20E illustrate steps for bonding multiple die utilizing anadhesive film, in accordance with an example embodiment of theinvention.

FIGS. 21A-21F illustrate steps in a die-to-die first bond structure, inaccordance with an example embodiment of the invention.

FIG. 22 is a schematic illustrating steps in a die-to-die first bondprocess, in accordance with an example embodiment of the invention.

FIG. 23 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention.

FIG. 24 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention.

FIGS. 25A-25E illustrate steps for debonding wafers with large backsidebumps, in accordance with an example embodiment of the invention.

FIG. 26 is a diagram illustrating die bonding utilizing a patternedunderfill layer, in accordance with an example embodiment of theinvention.

DETAILED DESCRIPTION OF VARIOUS ASPECTS OF THE DISCLOSURE

The following discussion presents various aspects of the presentdisclosure by providing various examples thereof. Such examples arenon-limiting, and thus the scope of various aspects of the presentdisclosure should not necessarily be limited by any particularcharacteristics of the provided examples. In the following discussion,the phrases “for example,” “e.g.,” and “exemplary” are non-limiting andare generally synonymous with “by way of example and not limitation,”“for example and not limitation,” and the like.

Certain aspects of the invention may be found in a method and system fora semiconductor device package with a die to interposer wafer firstbond. Example aspects of the invention may comprise bonding a pluralityof semiconductor die comprising electronic devices to an interposerwafer, and applying an underfill material between the plurality ofsemiconductor die and the interposer wafer. A mold material may beapplied to encapsulate the plurality of semiconductor die. Theinterposer wafer may be thinned to expose through-silicon-vias (TSVs)and metal contacts may be applied to the exposed TSVs. The interposerwafer may be singulated to generate a plurality of assemblies eachcomprising one or more of the plurality of semiconductor die and aninterposer die. The one or more of the plurality of assemblies may bebonded to one or more packaging substrates. The plurality of die may beplaced on the interposer wafer for the bonding utilizing an adhesivefilm. The interposer wafer may be singulated utilizing one or more of: alaser cutting process, reactive ion etching, a sawing technique, and aplasma etching process. The underfill material may be applied utilizinga capillary underfill process. The plurality of semiconductor die may bebonded to the interposer wafer utilizing a mass reflow process or athermal compression process. The one or more additional die may bebonded to the plurality of semiconductor die utilizing a mass reflowprocess or a thermal compression process. The mold material may comprisea polymer. The one or more additional die may comprise micro-bumps forcoupling to the plurality of semiconductor die.

FIG. 1A is a schematic illustrating an integrated circuit packageconfigured with a die-to-wafer first bond, in accordance with an exampleembodiment of the invention. Referring to FIG. 1A, there is shown apackage 100 comprising die 101, a packaging substrate 103, passivedevices 105, an interposer 107, solder balls 111, a lid 113, and thermalinterface material 118.

The die 101 may comprise integrated circuit die that have been separatedfrom one or more semiconductor wafers. The die 101 may compriseelectrical circuitry such as digital signal processors (DSPs), networkprocessors, power management units, audio processors, RF circuitry,wireless baseband system-on-chip (SoC) processors, sensors, andapplication specific integrated circuits, for example. In addition, thedie 101 may comprise micro-bumps 109 for providing electrical contactbetween the circuitry in the die 101 and contact pads on the surface ofthe interposer 107.

The interposer 107 may comprise a semiconductor wafer, such as a siliconwafer, with through-silicon-vias (TSVs) 115 that provide electricallyconductive paths from one surface of the interposer 107 to the oppositesurface. The interposer 107 may also comprise backside bumps 117 formaking electrical and mechanical contact to the packaging substrate 103.In another example scenario, the interposer 107 may comprise glass or anorganic laminate material, either of which may be capable of large panelformats on the order of 500×500 mm, for example.

The packaging substrate 103 may comprise a mechanical support structurefor the interposer 107, the die 101, the passive devices 105, and thelid 113. The packaging substrate 103 may comprise solder balls 111 onthe bottom surface for providing electrical contact to external devicesand circuits, for example. The packaging substrate 103 may also compriseconductive traces in a non-conductive material for providing conductivepaths from the solder balls to the die 101 via pads that are configuredto receive the backside bumps 117 on the interposer 107. Additionally,the packaging substrate 103 may comprise pads 119 for receiving thesolder balls 111. The pads 119 may comprise one or more under-bumpmetals, for example, for providing a proper electrical and mechanicalcontact between the packaging substrate 103 and the solder balls 111.

The passive devices 105 may comprise electrical devices such asresistors, capacitors, and inductors, for example, which may providefunctionality to devices and circuits in the die 101. The passivedevices 105 may comprise devices that may be difficult to integrate inthe integrated circuits in the die 101, such as high value capacitors orinductors. In another example scenario, the passive devices 105 maycomprise one or more crystal oscillators for providing one or more clocksignals to the die 101.

The lid 113 may provide a hermetic seal for the devices within thecavity defined by the lid 110 and the packaging substrate 103. A thermalinterface may be created for heat transfer out of the die 101 to the lid113 via the thermal interface material 118, which may also act as anadhesive.

In an example scenario, the package 100 may be fabricated by firstbonding the die 101 to the interposer 107 when the interposer is stillpart of a full wafer of interposer die, and may be bonded utilizing amass reflow or thermal compression process. The interposer wafer withattached die 101 may be processed for further assembly. For example, theinterposer wafer may be thinned and the backside bumps 117 may bedeposited. Furthermore, a capillary underfill material may be placedbetween the die 101 and the interposer before a mold process is utilizedto encapsulate the die 101 on the individual interposer die in theinterposer wafer.

An assembly comprising the die 101 and the interposer wafer may besingulated and the singulated assembly may then be bonded to thepackaging substrate 103 utilizing either mass reflow or thermalcompression. The lid 113 may be placed on the bonded assembly to providea hermetic seal and protect the circuitry from the external environment.Finally, electrical tests may be performed following the bondingprocesses to verify that proper electrical connections were made and noshorts or open circuits exist.

FIG. 1B is a schematic illustrating an integrated circuit packageconfigured with a die to interposer wafer first bond and stacked die, inaccordance with an example embodiment of the invention. Referring toFIG. 1B, there is shown a package 150 comprising the die 101, thepackaging substrate 103, the passive devices 105, the interposer 107,and a stack of dynamic random access memory (DRAM) 121. The die 101, thepackaging substrate 103, the passive devices 105, and the interposer 107may be substantially as described with respect to FIG. 1A, for example,but with different electrical connectivity for the different die 101 andthe stack of DRAM 121.

The DRAM 121 may comprise a stack of die for providing a high densitymemory for circuitry in the die 101 or external to the package 150. TheDRAM 121 may be stacked front-to-back and therefore comprise TSV's forproviding electrical connectivity between the individual die.

In an example scenario, the package 150 may be fabricated by firstbonding the die 101 and the DRAM 121 to the interposer 107 when still inwafer form, i.e. before singulation into individual interposer die. Thedie 101 and the DRAM 121 may be bonded utilizing mass reflow or thermalcompression process. The interposer wafer and bonded die may besingulated into separate functional die/interposer die assemblies beforebeing bonded to the packaging substrate 103. Furthermore, a capillaryunderfill process may follow the bonding processes for mechanical andinsulating purposes. Electrical tests may be performed following thebonding processes to verify that proper electrical connections were madeand no shorts or open circuits exist.

FIGS. 1C-1E illustrate example steps for bonding multiple die utilizingan adhesive film, in accordance with an example embodiment of theinvention. Referring to FIG. 1C, there is shown a plurality of die 122and an adhesive layer 129. Each of the plurality of die 122 may comprisemetal interconnects 123 for subsequent bonding to other die. In anotherexample scenario, the metal interconnects 123 may comprise microbumps orcopper pillars, for example.

The adhesive film 129 may comprise an adhesive tape or compliant layer,for example, to which the plurality of die 122 may be bonded, asillustrated in FIG. 1C. The adhesive film 129 may be a temporaryadhesive for attaching multiple die to other die within a wafer. Forexample, the interposer 127 may comprise a wafer of individualinterposer die (in which case the interposer 127 comprises an“interposer wafer”). In an example scenario, the plurality of die 122may be placed temporarily on the adhesive film 129. While FIG. 1Cillustrates the plurality of die 122 as consisting of three die, more orless die (including a single die) are also possible and contemplated.

An optional underfill material 125 may also be placed on the interposerwafer 127 as illustrated by underfill material 125 in FIG. 1D, beforebonding the plurality of die 122 to the interposer 127 utilizing theadhesive film 129. The underfill material 125 may be for subsequentthermal compression bonding processes, for example, and may allowinstant underfill through a snap cure during a subsequent thermalcompression bonding process. This may improve bonding yields since asingle underfill process may be utilized for the plurality of die 122 ascompared to a separate place and underfill process for each of the die122. The plurality of die 122 may be placed face up so that the metalinterconnects 123 may be coupled to a receiving die.

The plurality of die 122 on the adhesive film 129 may then be placed onthe interposer 127, as shown in FIGS. 1D and 1E, where the initialplacement of the plurality of die 122 on the adhesive film 129 mayenable fine control of the spacing and alignment of the plurality of die122 with the interposer 127. In an example scenario, the interposer 127may be gang bonded to the individual die 122. The interposer 127 maycomprise metal pads 131 for receiving the metal interconnects 123. Oncethe plurality of die 122 are placed on the interposer 127, a thermalcompression bond process may be performed for proper electrical andmechanical bonds between the metal interconnects 123 and the metal pads131. Once bonded, the adhesive film 129 may be removed resulting in thestructure shown in FIG. 1E.

FIGS. 2A-2F illustrate example steps in a die to interposer wafer firstbond structure, in accordance with an example embodiment of theinvention. Referring to FIG. 2A, there is shown an interposer wafer 201and a plurality of die 203A-203C. The die 203A-203C may compriseintegrated circuit die that have been separated from one or moresemiconductor wafers. The die 203A-203C may comprise electricalcircuitry such as digital signal processors (DSPs), network processors,power management units, audio processors, RF circuitry, wirelessbaseband system-on-chip (SoC) processors, sensors, and applicationspecific integrated circuits, for example. In addition, the die203A-203C may comprise micro-bumps 205 for providing electrical contactbetween the circuitry in the die 203A-203C and front side pads 209 onthe surface of the interposer wafer 201.

The interposer wafer 201 may comprise a plurality of individualinterposer die, each of which may be coupled to one or more die, such asthe die 203A-203C. The interposer wafer 201 may also comprise front sidepads 209 for providing electrical contact to the die 203A-203C.Furthermore, the interposer wafer 201 may comprise through-silicon-vias(TSVs) 207 for providing electrically conductive paths from one surfaceof the interposer to the other, once the interposer wafer 201 has beenthinned.

The die 203A-203C may be placed on the interposer wafer 201 and bondedusing a thermal compression bonding technique, for example. In anotherexample scenario, a mass reflow process may be utilized to bond the die203A-203C. A non-conductive paste (NCP) may also be utilized to assistin forming the bonds. In addition, a capillary underfill may then beapplied and may fill the volume between the die 203A-203C and theinterposer wafer 201. FIG. 2B illustrates the die 203A-203C bonded tothe interposer wafer 201 with underfill material 210. When deposited orplaced, the underfill material 210 may comprise a film, paste, b-stagefilm, or a liquid, for example.

The space between the die 203A-203C may be filled with a mold material211, as illustrated in FIG. 2C. The mold material 211 may comprise apolymer material, for example, that may provide a non-conductivestructural support for die bonded to the interposer wafer 201,protecting the die in subsequent processing steps and when diced intoindividual packages. In an example scenario, the interposer wafer 201may be thinned utilizing a back side polish or grind, for example, toexpose the TSVs.

While the underfill material 210 is shown in FIGS. 2B-2F, the moldmaterial itself may be utilized as underfill material for each couplinginterface, such as between the die 203A and 203B and the interposerwafer 201. In another example embodiment, underfill material may beinserted as a liquid or paste, placed as a film, or a b-staged film andmay be placed sequentially as each die to substrate or die to die bondis made, or may be made all at one time after all the electrical bondsare made.

In another example scenario, the interposer wafer 201 may be thinned toa thickness where the TSVs are still slightly covered, which may then beetched selectively in areas covering the TSVs. A protective layer maythen be deposited over the remaining silicon and a polish of the exposedTSVs may be performed for improved contact to the TSVs. Additionally,metal pads may be deposited on the polished TSVs for better contact withthe backside bumps 213.

After the interposer wafer 201 has been thinned, the backside bumps 213may be deposited, as shown in FIG. 2D, for making contact between theTSVs and subsequently bonded substrates, such as packaging substrates.

The molded assembly may then be singulated utilizing a cuttingtechnology such as reactive ion etching, plasma etching (e.g. aninductively coupled plasma), laser cutting, or mechanical saw. In anexample scenario, the molded assembly may be partially cut and thenseparated with a mechanical pulling apart of the die.

The singulated molded die/interposer assembly comprising the die203A-203B and the interposer die 201A may then be bonded to thepackaging substrate 215 via the backside bumps 213, as illustrated inFIG. 2E. The packaging substrate 215 may comprise contact pads 219 formaking contact with the backside bumps 213 on the interposer die 201Aand for subsequent placement of solder balls 227 as shown in FIG. 2F.

In addition, the lid 221 may be placed on the package assembly with ahermetic seal made with an adhesive 225 at the surface of the packagingsubstrate 215, which may also comprise a thermal interface material.Accordingly, the lid 221 may make contact with the top surfaces of thedie 203A and 203B for thermal heat sinking purposes. The solder balls227 may comprise metal spheres for making electrical and mechanicalcontact with a printed circuit board, for example.

FIG. 3 is a schematic illustrating example steps in a die to interposerwafer first bond process, in accordance with an example embodiment ofthe invention. Referring to FIG. 3, there is shown a die to interposerwafer process beginning with a die to interposer wafer attach andunderfill step 301A. The one or more die may be bonded utilizing athermal compression bonding technique, for example. Additional die mayalso be bonded to the first bonded die, such as illustrated by the DRAMstack 121 shown in FIG. 1B, or the interposer wafer as shown in FIG. 1A,in the next die to interposer wafer attach and underfill step 301B.

A capillary underfill process may be utilized following the bondingprocess, which may provide an insulating barrier between contacts andmay fill the volume between the die and the interposer wafer. It shouldbe noted that the process is not limited to a thermal compressiontechnique. Accordingly, a mass reflow process may be utilized, forexample. Thermal compression bonding techniques may be advantageous at40 micron pitch or less and white bumps, i.e. high-k dielectric layerdelamination, may be eliminated with thermal compression bonding. Inaddition, flatness may be improved with thermal compression bonding,resulting in fewer open circuit connections due to excessive gaps.

A molding step 303 may then be utilized to package the die/interposerassembly before thinning the interposer substrate to expose the TSVs inthe backside finish step 305. In addition, backside contacts may beapplied to the exposed TSVs in the interposer wafer.

The molded die/interposer wafer assembly may then be singulated into aplurality of molded die on interposer die assemblies in the singulatestep 307. Singulation may be performed via laser cutting, plasmaetching, reactive ion etching, or a sawing technique, for example.

The singulated assemblies may then be attached to packaging substrates,utilizing either a mass reflow technique in step 309A or a thermalcompression technique in step 309B, utilizing the deposited backsidecontacts. If the mass reflow bonding step 309A is utilized, thedie/interposer/packaging substrate assembly may then be subjected to areflow step 311 where the interposer die to packaging substrate contactsmay be reflowed resulting in proper electrical and physical contact.This may be followed by a capillary underfill process at step 313 wherethe volume between the interposer die and the packaging substrate isunderfilled, for example providing an insulating material between thecontacts and filling the void to reject contamination.

If the singulated assembly is bonded to a packaging substrate utilizinga thermal compression technique in step 309B, the bonded assembly mayproceed to step 315. Note that the thermal compression technique in step309B may, for example, include applying a pre-applied underfill beforethermal compression. In another example scenario, such underfill mayalso be applied after step 309B, for example in a process analogous tostep 313.

Finally, the bonded package may be subjected to a final test step 315for assessing the performance of the electronic circuitry in the bondeddie and to test the electrical contacts made in the bonding processes.

FIG. 4 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 4, there is shown a boat 401, clips 403, a plurality of die 405,and an interposer 407. The boat 401 may comprise a rigid supportstructure in which a die/interposer assembly, where the interposer 407may be in wafer form, may be placed and held in place by the clips 403.The boat 401 may be capable of withstanding high temperatures, above 200C, for example used for processing the die/interposer assembly.

The plurality of die 405 may be bonded to the interposer 407 via athermal compression bonding, technique, for example, prior to beingplaced in the boat 401. As the temperature of the boat 401 the pluralityof die 405, and the interposer 407 increases, the curvature of anassembly comprising the plurality of die 405 and the interposer 407 mayflatten with the clips 403 providing a downward force at the outer edgesof the assembly. As the curvature approaches zero, the increased lengthin the lateral direction may be accommodated by sliding under the clips403. In addition, the boat 401 provides mechanical support inconjunction with the downward force of the clips 403, therebyplanarizing the assembly.

The boat 401 and clips 403 may permit the partially assembled package toheat up in normal fashion, but when the die/interposer assembly hasbecome flat with increased temperature, the boat 401 and clips 403resist the normal progression of the warpage, holding the partiallyassembled package, flattening it during heating and then maintainingthat flatness of the silicon interposer as temperatures climb higher.

FIG. 5 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 5, there is shown a boat 501, a plurality of die 505, an interposer507, vacuum sealing rings 509, vacuum channels 511, a valve 513, and avacuum supply 515.

In an example scenario, the boat 501 comprises a vacuum system toflatten the partially assembled package comprising the plurality of die505 and the interposer 507. In an example scenario, the boat 501 mayaccept die/interposer assemblies when the interposer 507 is still inwafer form. The vacuum-mechanical system permits the partially assembledpackage to heat up in normal fashion, but when the partially assembledpackage has become flat, the vacuum-mechanical system resists the normalprogression of the warpage, holding the partially assembled package in aflattened configuration during heating and then maintains that flatnessof the silicon interposer 507 as temperatures increases.

The vacuum may be applied at room temperature or slightly elevatedtemperatures utilizing the vacuum supply 515 via the valve 513 and thevacuum channels 511, and may be held utilizing the high-temperaturesealing rings 509 so that the vacuum-mechanical boat 501 may travelthrough a standard reflow furnace and still maintain sufficient vacuumto maintain interposer silicon top surface planarity.

FIGS. 6A-6E illustrate example steps for debonding wafers with largebackside bumps, in accordance with an example embodiment of theinvention. Referring to FIG. 6A, there is shown a carrier wafer 601, awafer 603 with backside bumps 605, and a polymer layer 607.

The wafer 603 may comprise an electronics, or functional, wafer or aninterposer wafer, for example, which may comprise large backside bumps605 that may be susceptible to damage in debond processes. Accordingly,the polymer layer 607 may be applied to protect the backside bumps 605during debond processes. The polymer layer 607 may comprise a resistmaterial or an adhesive film or tape, for example, that may be appliedon the wafer 603 over the backside bumps 605.

A subsequent chuck attachment, such as with a vacuum technique, to thecarrier wafer 601 and the top surface of the polymer layer 607 is shownin FIG. 6B. The top chuck 609A may be moved in one lateral directionwhile the bottom chuck 609B may be moved in the opposite direction toseparate the carrier wafer 601 from the wafer 603. The polymer layer 607may enable a proper vacuum seal to the surface, where there may be apoor seal when applied directly to the backside bumps 605.

FIG. 6C shows the resulting structure following debond from the carrierwafer 601. Any adhesive residue remaining from the carrier wafer 601 maybe removed in a cleaning process while still attached to the top chuck609A.

The cleaned structure may then be affixed to a film frame 611 with thebackside bumps 605 facing up, as shown in FIG. 6D, for example. Thepolymer layer 607 may then be removed either chemically or thermallyfollowed by a surface clean, resulting in the bonded wafer 603 shown inFIG. 6E, for example. The film frame 611 may enable further processingand ease of transport for the bonded wafer 603.

FIG. 7 is a diagram illustrating die bonding utilizing a patternedunderfill layer, in accordance with an example embodiment of theinvention. Referring to FIG. 7, there is shown a top die 701 withmicrobumps 703 and a bottom die 705 comprising contact pads 707 and anunderfill layer 709.

In an example scenario, the microbumps 703 may comprise copper pillars,for example, and may correspond to the contact pads 707 in the bottomdie 705. Although the bottom die 705 is shown as a single die, inanother example scenario, it may comprise an entire wafer of die, with aplurality of top die 701 being bonded to an interposer wafer 705 asopposed to a single die. The underfill layer 709 may comprise a polymerapplied to the top surface of the bottom die 705 that the next leveldie, e.g., the top die 701, will be bonded to. The polymer may comprisea re-passivation or pre-applied underfill that will flow and bond toboth die surfaces negating the need for subsequent underfill processes.

Furthermore, the underfill layer 709 may be patterned utilizingphotolithography techniques or laser ablation to expose the appropriatecontact pads 707 in the bottom die 705, for example by forming wells inthe underfill layer 709. The layer 709 may comprise a film where theopenings may comprise full depth pockets or partial depth pockets, forexample, generated using laser ablation or photolithography techniques.Material remaining in the partial depth pockets may assist in thebonding process of the top die 701 to the bottom die 705, for example.

The exposed pads may be utilized to align the top die 701 to the bottomdie 705. The die may be bonded utilizing a thermal compression or massreflow technique, for example. A flux dip may be utilized to aid inwetting of solder from one surface to the other and the underfill may“snap-cure” and seal both to the top and bottom die surfaces.Furthermore the underfill may flow around and under the microbumps 703and the contact pads 707 during the bond process.

In an embodiment of the invention, a method and system are disclosed fora semiconductor device package 100, 150 with a die to interposer waferfirst bond. In this regard, aspects of the invention may comprisebonding a plurality of semiconductor die 101, 121, 203A-203C, 405, 505,701 comprising electronic devices to an interposer wafer 127, 201, andin instances where wafer 603 comprises an interposer wafer, 603, andapplying an underfill material 210, 217, 709 between the plurality ofsemiconductor die 101, 121, 203A-203C, 405, 505, 701 and the interposerwafer. A mold material 211, 303 may be applied to encapsulate theplurality of semiconductor die 101, 121, 203A-203C, 405, 505, 701.

The interposer wafer 127, 201, and in instances where wafer 603comprises an interposer wafer, 603, may be thinned to exposethrough-silicon-vias (TSVs) and metal contacts 213, 707 may be appliedto the exposed TSVs. The interposer wafer 127, 201, and in instanceswhere wafer 603 comprises an interposer wafer, 603, may be singulated togenerate a plurality of assemblies 100, 150 each comprising one or moreof the plurality of semiconductor die 101, 121, 203A-203C, 405, 505, 701and an interposer die 107, 201A, 407, 507, 705. The one or more of theplurality of assemblies may be bonded to one or more packagingsubstrates 103. The plurality of die 101, 121, 203A-203C, 405, 505, 701may be placed on the interposer wafer 127, 201, and in instances wherewafer 603 comprises an interposer wafer, 603, for the bonding utilizingan adhesive film 611.

The interposer wafer 127, 201, and in instances where wafer 603comprises an interposer wafer, 603, may be singulated utilizing one ormore of: a laser cutting process, reactive ion etching, a sawingtechnique, and a plasma etching process. The underfill material 210,217, 709 may be applied utilizing a capillary underfill process. Theplurality of semiconductor die 101, 121, 203A-203C, 405, 505, 701 may bebonded to the interposer wafer 127, 201, and in instances where wafer603 comprises an interposer wafer, 603, utilizing a mass reflow processor a thermal compression process.

The one or more additional die 101, 121, 203A-203C, 405, 505, 701 may bebonded to the plurality of semiconductor die 101, 121, 203A-203C, 405,505, 701 utilizing a mass reflow processor a thermal compressionprocess. The mold material 211, 303 may comprise a polymer. The one ormore additional die 101, 121, 203A-203C, 405, 505, 701 may comprisemicro-bumps for coupling to the plurality of semiconductor die 101, 121,203A-203C, 405, 505.

Certain aspects of the invention may be found in a method and system fora semiconductor device package with a die-to-packaging substrate firstbond. Example aspects of the invention may comprise bonding a firstsemiconductor die to a packaging substrate, applying an underfillmaterial between the first semiconductor die and the packagingsubstrate, and bonding one or more additional die to the firstsemiconductor die. The one or more additional die may compriseelectronic devices. The first semiconductor die may comprise aninterposer die, or the first semiconductor die may comprise electronicdevices. The first semiconductor die may be bonded to the packagingsubstrate utilizing a mass reflow process or a thermal compressionprocess. The one or more additional die may be bonded to the first dieutilizing a mass reflow process or a thermal compression process. Thebonded first die and the bonded one or more additional die may beencapsulated in a mold material. The mold material may comprise apolymer. The one or more additional die may comprise micro-bumps forcoupling to the first semiconductor die.

FIG. 8A is a schematic illustrating an integrated circuit packageconfigured with an interposer-to-packaging substrate first bond, inaccordance with an example embodiment of the invention. Referring toFIG. 8A, there is shown a package 800 comprising die 801, a packagingsubstrate 803, passive devices 805, an interposer 807, solder balls 811,a lid 813, and thermal interface material 818.

The die 801 may comprise integrated circuit die that have been separatedfrom one or more semiconductor wafers. The die 801 may compriseelectrical circuitry such as digital signal processors (DSPs), networkprocessors, power management units, audio processors, RF circuitry,wireless baseband system-on-chip (SoC) processors, sensors, andapplication specific integrated circuits, for example. In addition, thedie 801 may comprise micro-bumps 809 for providing electrical contactbetween the circuitry in the die 801 and contact pads on the surface ofthe interposer 807.

The interposer 807 may comprise a semiconductor die, such as a silicondie, with through-silicon-vias (TSVs) 815 that provide electricallyconductive paths from one surface of the interposer 807 to the oppositesurface. The interposer 807 may also comprise backside bumps 817 formaking electrical and mechanical contact to the packaging substrate 803.In another example scenario, the interposer 807 may comprise glass or anorganic laminate material, either of which may be capable of large panelformats on the order of 500×500 mm, for example.

The packaging substrate 803 may comprise a mechanical support structurefor the interposer 807, the die 801, the passive devices 805, and thelid 813. The packaging substrate 803 may comprise solder balls 811 onthe bottom surface for providing electrical contact to external devicesand circuits, for example. The packaging substrate 803 may also compriseconductive traces in a non-conductive material for providing conductivepaths from the solder balls to the die 801 via pads that are configuredto receive the backside bumps 817 on the interposer 807. Additionally,the packaging substrate 803 may comprise pads 819 for receiving thesolder balls 811. The pads 819 may comprise one or more under-bumpmetals, for example, for providing a proper electrical and mechanicalcontact between the packaging substrate 803 and the solder balls 811.

The passive devices 805 may comprise electrical devices such asresistors, capacitors, and inductors, for example, which may providefunctionality to devices and circuits in the die 801. The passivedevices 805 may comprise devices that are difficult to integrate in theintegrated circuits in the die 801, such as high value capacitors orinductors. In another example scenario, the passive devices 805 maycomprise one or more crystal oscillators for providing one or more clocksignals to the die 801.

The lid 813 may provide a hermetic seal for the devices within thecavity defined by the lid 810 and the packaging substrate 803. A thermalinterface may be created for heat transfer out of the die 801 to the lid813 via the thermal interface material 818, which may also act as anadhesive.

In an example scenario, the package 800 may be fabricated by firstbonding the interposer 807 to the packaging substrate 803 utilizing amass reflow or thermal compression process. The die 801 may subsequentlybe bonded to the interposer 807 utilizing either mass reflow or thermalcompression. A capillary underfill process may follow the bondingprocess for mechanical and insulating purposes. Electrical tests may beperformed following the bonding processes to verify that properelectrical connections were made and no shorts or open circuits exist.

FIG. 8B is a schematic illustrating an integrated circuit packageconfigured with an interposer-to-packaging substrate first bond andstacked die, in accordance with an example embodiment of the invention.Referring to FIG. 8B, there is shown a package 850 comprising the die801, the packaging substrate 803, the passive devices 805, theinterposer 807, and a stack of dynamic random access memory (DRAM) 821.The die 801, the packaging substrate 803, the passive devices 805, andthe interposer 807 may be substantially as described with respect toFIG. 8A, for example, but with different electrical connectivity for thedifferent die 801 and the stack of DRAM 821.

The DRAM 821 may comprise a stack of die for providing a high densitymemory for circuitry in the die 801 or external to the package 850. TheDRAM 821 may be stacked front-to-back and therefore comprise TSV's forproviding electrical connectivity between the individual die.

In an example scenario, the package 850 may be fabricated by firstbonding the interposer 807 to the packaging substrate 803 utilizing amass reflow or thermal compression process. The die 801 may subsequentlybe bonded to the interposer 807 utilizing either mass reflow or thermalcompression. In addition, the stack of DRAM 821 may then be bonded tothe interposer 807. A capillary underfill process may follow the bondingprocess for mechanical and insulating purposes. Electrical tests may beperformed following the bonding processes to verify that properelectrical connections were made and no shorts or open circuits exist.

FIGS. 8C-8E illustrate steps for bonding multiple die utilizing anadhesive film, in accordance with an example embodiment of theinvention. Referring to FIG. 8C, there is shown a plurality of die 822and an adhesive layer 829. Each of the plurality of die 822 may comprisea metal interconnect 823 for subsequent bonding to other die. In anotherexample scenario, the metal interconnects 823 may comprise microbumps orcopper pillars, for example.

The adhesive film 829 may comprise an adhesive tape or compliant layer,for example, to which the plurality of die 822 may be bonded, asillustrated in FIG. 8C. The adhesive film 829 may be a temporaryadhesive for attaching multiple die to another die. In an examplescenario, the plurality of die 822 may be placed temporarily on theadhesive film 829. While FIG. 8C illustrates the plurality of die 822 asconsisting of three die, more or less die (including a single die) arealso possible and contemplated.

An optional underfill material 825 may also be placed on a die 827 asshown in FIG. 8D, once the plurality of die 822 have been attached tothe adhesive film 829. The underfill material 825 may be for subsequentthermal compression bonding processes, for example, and may allowinstant underfill through a snap cure during a subsequent thermalcompression bonding process. This may improve bonding yields since asingle underfill process may be utilized for the plurality of die 822 ascompared to a separate place and underfill process for each of theplurality of die 822. The plurality of die 822 may be placed face up sothat the metal interconnects 823 may be coupled to a receiving die.

The plurality of die 822 on the adhesive film 829 may then be placed onthe die 827 (or other substrate, for example, a packaging substrate), asshown in FIGS. 8D and 8E, for example, where the initial placement ofthe plurality of die 822 on the adhesive film 829 may enable finecontrol of the spacing and alignment of the plurality of die 822 withthe die 827. In an example scenario, the die 827 may be gang bonded tothe individual die 822. The die 827 may comprise metal pads 831 forreceiving the metal interconnects 823. Once the plurality of die 822 areplaced on the die 827, a thermal compression bond process may beperformed for proper electrical and mechanical bonds between the metalinterconnects 823 and the metal pads 831. Once bonded, the adhesive film829 may be removed resulting in the structure shown in FIG. 8E.

FIG. 9 is a schematic illustrating a die to packaging substrate processflow, in accordance with an example embodiment of the invention.Referring to FIG. 9, there is shown die to packaging process 900 thatcomprises a paste print step 901, a flux jet step 903, a passives mountstep 905, and thermal compression bond interposer step 907. Thepackaging process 900 may also comprise a flux clean step 909 anunderfill and cure step 911, a flux dip step 913, and a thermalcompression top die bond step 915. These steps may be followed by anunderfill and cure step 917, a lid attach step 919, a laser mark step921, and a ball grid array (BGA) attach step 923.

The paste print step 901 may comprise the application of non-conductivepaste to assist in the subsequent thermal compression bonding of die tothe packaging substrate. The die to be bonded may comprise an interposerdie or a functional die, which may comprise digital signal processors(DSPs), network processors, power management units, audio processors, RFcircuitry, wireless baseband system-on-chip (SoC) processors, sensors,and application specific integrated circuits, for example.

The flux jet step 903 may comprise the preparation of the conductivesurfaces on the packaging substrate for subsequent conductive bonding.The flux process may comprise a surface cleaning step and may removeexcessive oxide layers on the surfaces to be bonded. For example, thepads on the packaging substrate may be fluxed for subsequent bondingwith backside bumps on the interposer die or for microbumps on afunctional die. Additionally, bond pads on the packaging substrate maybe prepared for the subsequent mounting of passive devices.

In the passives mount step 905, passive devices, such as the passivedevices 805 described with respect to FIGS. 8A and 8B, may be mounted tothe packaging substrate. In the thermal compression bond Interposer step907, an interposer die may be bonded to the packaging substrateutilizing a thermal compression bonding process. The previously appliednon-conductive paste may be physically displaced by the compression ofconductive surfaces. While a thermal compression bonding process isshown in FIG. 9, a mass reflow process may also be used for bonding theinterposer or functional die to the packaging substrate. Examples ofthis process are shown in FIGS. 10 and 14.

In the flux clean step 909, residual flux may be removed in a solventand/or deionized (DI) water rinse, for example, followed by a dryingprocess at an elevated temperature. This may prepare the bondedstructure for a capillary underflow process in the underfill/cure step911. In this process, an underflow material may be injected at the edgesof the bonded die and capillary action at an elevated temperature maydistribute the material uniformly under the bonded die, providing aprotective dielectric layer around the electrical bonds. Once thecapillary action has distributed the underfill material, it may be curedat an elevated temperature for an extended time.

Following the capillary underfill and cure process, the flux dip step813 may be performed, which may flux the bond regions on the bondedinterposer or functional die for subsequent bonding to microbumps onother die. The flux material may provide a cleaning mechanism for thebonding surfaces and may remove excess oxide layers from the metal.

A top die may then be bonded to the structure in a thermal compressiontop die step 915. The top die may be bonded to the previously bondedinterposer die or a previously bonded functional die. The top die may bepressed against the interposer die/packaging substrate at an elevatedtemperature to provide an electrical and mechanical support formed bythe bonded contacts. As with the thermal compression bond interposerstep 907, the thermal compression bond top die step 915 may insteadcomprise a mass reflow bonding process, as illustrated in FIG. 10, forexample.

Another underfill and cure process may be performed, but for the topdie, in the underfill/cure step 917, which may comprise the injection ofan underfill material that may redistribute under the top die viacapillary action at an elevated temperature. Similarly, the underfillmaterial may then be cured at an elevated temperature for an extendedtime, up to a few hours, for example.

The process may continue with the lid attach step 919, which may place aprotective and hermetic seal, if desired, over the bonded die,interposer, and packaging substrate, similar to the lid 813 shown inFIG. 8A for example. This may be followed by a laser mark step 921 whereidentifying marks may be made in the lid and/or packaging substrate.Finally, a ball grid array (BGA) attach step 923 may be performed tomount solder balls, e.g. solder balls 811, to the packaging substratefor subsequent bonding to a circuit board or other support structure.The BGA may be subjected to a reflow process to ensure good electricaland mechanical contact to the pads on the packaging substrate.

FIG. 10 is a schematic illustrating bonding options for die in apackage, in accordance with an embodiment of the invention. Referring toFIG. 10, there are shown four process variations comprising mass reflowand thermal compression bonding steps. Each process illustrates a firstdie bonding process, which may comprise an interposer die to a packagingsubstrate, and a second bond comprising a die to the previously bondedinterposer die.

The first process comprises a mass reflow/mass reflow process, with thefirst step being an interposer die to substrate attach step 1001A,followed by a reflow step 1003A, and underfill step 1005A, a die tointerposer attach step 1007A, a second reflow step 1003B, a secondunderfill step 1005B, and a final test step 1009.

In this example scenario, the interposer die to substrate attach step1001A and the die to interposer attach step 1007A may comprise massreflow bonding processes (e.g., at steps 1003A and 1003B, respectively).

The second process flow comprises a thermal compression first bond and amass reflow second bond. The process thus comprises a thermalcompression/non-conductive paste/capillary underfill interposer die tosubstrate bonding step 1001B, a die to interposer attach step 1007A,followed by the reflow step 1003B, the underfill step 1005B, and thefinal test step 1009.

The third process flow comprises two thermal compression bondingprocesses, so that the process comprises the thermalcompression/non-conductive paste/capillary underfill interposer die tosubstrate bonding step 1001B, a thermal compression/non-conductivepaste/capillary underfill die to interposer bonding step 1007B, and thefinal test step 1009.

Finally, the fourth process flow comprises a mass reflow first bond anda thermal compression second bond, so that the process comprises theinterposer die to substrate attach step 1001A, the reflow step 1003A,the underfill step 1005A, the thermal compression/non-conductivepaste/capillary underfill die to interposer bonding step 1007B, and thefinal test step 1009.

The process flows shown in FIG. 10 illustrate that any combination ofmass reflow and thermal compression may be utilized to bond the variousdie in the package. Thermal compression bonding techniques may beadvantageous at 40 micron pitch or less and white bumps, i.e. high-kdielectric layer delamination, may be eliminated with thermalcompression bonding. In addition, flatness may be improved with thermalcompression bonding, resulting in fewer open circuit connections due toexcessive gaps.

FIGS. 11A-11C illustrate a process for an interposer-to-packagingsubstrate first bond, in accordance with an example embodiment of theinvention. Referring to FIG. 11A, there is shown the packaging substrate803 and the interposer 807. The packaging substrate 803 and theinterposer 807 may be as described previously, for example, where thepackaging substrate 803 may comprise the pads 819 and the interposer 807may comprise the TSVs 815 and the backside bumps 817.

The interposer die 807 may be bonded to the packaging substrate 803utilizing a mass reflow process or a thermal compression withnon-conductive paste process. The mass reflow process may comprise aflux dip to prepare the metal surfaces for proper bonding. The thermalcompression bonding process may comprise the selective application ofnon-conductive paste or film to assist in the bonding process. Inaddition, a capillary underfill process may fill the void between thebackside bumps 817 in the region between the interposer 807 and thepackaging substrate 803, as illustrated by the underfill 1011A forexample.

In FIG. 11B, the die 801 may be bonded to the interposer die 807utilizing a mass reflow process or a thermal compression withnon-conductive paste process. As with the interposer die 807, acapillary underfill process may fill the void between the microbumps 809in the region between the die 801 and the interposer die 807, asillustrated by the underfill 1101B shown in FIG. 11C for example.

While the coupling of two die 801 to the interposer die 807 isillustrated in FIGS. 11A-11C, the invention is not necessarily solimited. Accordingly, any number of die may be bonded to the interposer807 determined by available space and power and thermal requirements,for example. Furthermore, die may be stacked on the interposer die 807,as illustrated in FIG. 8B for example.

Finally, the solder balls 811 may be placed on the pads 819 on thepackaging substrate 803. A flux process may be utilized to prepare thesolder balls 811 and the pads 819. The solder balls 811 may be subjectedto a reflow process following placement to make low resistance andmechanically sound contacts to the pads 819.

FIG. 12 is a flow diagram illustrating an interposer fabricationprocess, in accordance with an example embodiment of the invention.Referring to FIG. 12, an incoming interposer wafer may proceed to thefront side pads step 1201 where contact pads may be deposited on thefront side of the interposer wafer. In an example scenario, the frontside pads may comprise nickel/palladium/gold.

The interposer wafer may then proceed to the wafer support step 1203,where the wafer may be bonded to a support substrate with an adhesivelayer, for example. In an example scenario, the support structure maycomprise a rigid substrate, such as a silicon substrate, for example,with an adhesive layer for affixing the interposer wafer. The frontsurface with contact pads may be affixed to the wafer support to allowprocessing of the back surface. This support may allow subsequentprocessing steps, such as thinning of the interposer, without causingcatastrophic physical damage.

In the thin step 1205, the interposer wafer may be thinned down to athickness that exposes the TSVs in the substrate. The thinning maycomprise a chemical-mechanical polish (CMP) process for removingmaterial at the back surface of the interposer.

The thinning step 1205 may be followed by the back side bump step 1207,where metal bumps may be attached at the exposed TSVs to enableelectrical contact to the back surface. The back side bumps may beutilized to bond the interposer to a packaging substrate, for example.The back side bumps may be subjected to a reflow process to ensureproper electrical and mechanical bonds to the interposer.

After the back bumps have been applied, the interposer may be removedfrom the wafer support in the debond step 1209. This may comprise athermal ramp for removing the adhesive layer and/or may comprise asolvent step for removing the adhesive. Finally, the interposer mayproceed to the assembly step 1211, where the interposer may besingulated and integrated into a package as shown in FIGS. 8A-11C, forexample.

FIGS. 13A and 13B illustrate initial steps in an interposer fabricationprocess, in accordance with an example embodiment of the invention.Referring to FIG. 13A, there is shown an interposer 1310 (e.g., aninterposer wafer) and a support structure 1303. The support structure1303 may comprise a multi-layer structure. In an example scenario, thesupport structure 1303 may comprise a rigid substrate, such as a siliconsubstrate, for example, with an adhesive layer for affixing theinterposer 1310 to the support structure 1303.

The interposer 1310 may comprise a thick substrate prior to thinning,with front side pads 1301 that may be utilized as contact pads forsemiconductor die that will be coupled to the interposer 1310 followingprocessing. The interposer 1310 at this stage may be thicker than thethickness of the interposer 807 as integrated in FIGS. 8A-11C for easeof handling and processing, such as the deposition of the front sidepads 1301. The interposer 1310 may comprise TSVs 815 that extendpartially through the thick substrate, where the TSVs 815 will beexposed after subsequent thinning of the interposer wafer 1310. Theinterposer 1310 may also comprise a metal interconnect layer 1305 forcoupling the TSVs 815 to appropriate front side pads 1301.

FIG. 13B illustrates the support structure 1303 affixed to theinterposer wafer 1310 and the subsequent direction of thinning. Theinterposer 1310 may be thinned utilizing a CMP process, for example, andmay be thinned to expose the TSVs 815.

FIGS. 13C-13D illustrate the final steps in an interposer fabricationprocess, in accordance with an example embodiment of the invention.Referring to FIG. 13C, there is shown the thinned interposer 1310 withthe affixed support structure 1303. With the TSVs 815 exposed, metalbumps may be attached at the exposed TSV 815 surfaces, resulting in theback side bumps 1307, which may be utilized to couple the interposer1310 to a packaging substrate.

After the back side bumps 1307 are attached, the support structure 1303may be removed through a heating process, or a solvent process, forexample. The resulting structure may comprise an interposer 1310 thatmay subsequently be diced into individual interposers comprising die,such as the interposer 807.

FIG. 14 is a flow diagram illustrating a stacked die to packagingsubstrate fabrication process, in accordance with an example embodimentof the invention. Referring to FIG. 14, in step flux dip step 1401, apackaging substrate may be placed in a flux dip to prepare metal contactsurfaces for bonding with metal bumps, such as C4 micro bumps, on asemiconductor die (e.g., an electronics or functional die, an interposerdie, etc.).

In mass reflow bottom die step 1403, a first die may be bonded to thepackaging substrate utilizing a mass reflow process. While a mass reflowprocess is shown for attaching the bottom die, the invention is notnecessarily so limited. Accordingly, other bonding techniques may beutilized, such as a thermal compression process.

In flux clean step 1405, a cleaning process may be performed on thebonded die and packaging substrate to remove any remaining flux,followed by an underfill/cure step 1407, where an underfill material maybe placed in the space between the bonded die and the packagingsubstrate. The underfill material may fill the volume under a capillaryaction, for example. Once the material is injected into the volume, itmay be cured at an elevated temperature for hardening.

Once the underfill material is cured, one or more top die may be bondedto the bottom die in the thermal compression top die and non-conductivepaste step 1411. In this step, a non-conductive paste may be placed onthe top surface of the bottom die for subsequent bonding of one or moretop die. An example structure may comprise a logic die as the bottom dieand one or more memory die as the top die.

In the cure step 1413, the non-conductive paste may be cured at anelevated temperature, ensuring a sound mechanical bonding of the top dieto the bottom die. This may be followed by the over mold step 1415,where a mold material may be placed over the bonded structure to resultin a molded package. The mold material may provide encapsulation of thedie and substrate package, for example, and may protect the circuitryfrom external stressors.

In the thermal interface material step 1417, a material with goodthermal conductivity may be placed on the exposed top surface of the topdie. This may enable heat sinking for the bonded die with a thermallyconductive layer conducting heat away from the bonded die to asubsequently attached heat sink. In instances where the mold materialremains on the top surface of the top die after the over mold step 1415,the mold material may be removed in a grind step.

This may be followed by a laser mark step 1419 where identifying marksmay be placed on the molded package, followed by ball grid array (BGA)attach step 1421, where conductive balls may be attached to the bottomsurface of the packaging substrate. The BGA may subsequently be utilizedto attach the entire package to a circuit board, for example.

FIGS. 15A and 15B illustrate initial steps in a functional die topackage substrate assembly process, in accordance with an exampleembodiment of the invention. Referring to FIG. 15A, there is shown a die1501A and the packaging substrate 803. The packaging substrate 803 maybe as described previously, for example, and may comprise back side pads819 for subsequent bonding of solder balls.

The die 1501A may comprise electrical circuitry such as digital signalprocessors (DSPs), network processors, power management units, audioprocessors, RF circuitry, wireless baseband system-on-chip (SoC)processors, sensors, and application specific integrated circuits, forexample. Furthermore, the die 1501A may comprise the micro-bumps 809 formaking electrical contact to the packaging substrate 803. The die 1501Amay be bonded to the packaging substrate utilizing a mass reflow processor a thermal compression and non-conductive paste bonding process.

Following the bonding process, a capillary underfill process may beperformed to fill the volume between the die 1501A and the packagingsubstrate 803 with a subsequent curing process. When deposited orplaced, the underfill material 1503A may comprise a film, paste, b-stagefilm, or a liquid, for example. The resulting structure is illustratedin FIG. 15B.

FIGS. 15C and 15D illustrate final steps in a functional die to packagesubstrate assembly process, in accordance with an example embodiment ofthe invention. Referring to FIG. 15C, the die 1501B may be bonded to thedie 1501A previously bonded to the packaging substrate 803. The die1501B may be coupled to the die 1501A via a thermal compression andnon-conductive paste process. Micro-bumps 809 on the die 1501B may becoupled to pads on the die 1501A. In another example scenario, the die1501B may be coupled to the die 1501A utilizing a mass reflow process.

An over mold process may be utilized to encapsulate the bondedstructure, resulting in the over mold 1521. The over mold 1521 maycomprise a polymer that is placed on and around the die 1501A and 1501Band the packaging substrate 803 via a compression molding process. In anexample scenario, the over mold may be placed around the die 1501A and1501B, but not on top so that the thermal interface material 1511 may bedeposited on top of the die 1501B. In another example scenario, the overmold process may result in over mold remaining on the top surface of thedie 1501B but then removed, such as through a grinding or CMP process.

While the underfill material 1503A is shown in FIGS. 15C to 15E, theover mold material itself may be utilized as underfill material for eachcoupling interface, such as between the interposer 803 and the die 1501Aand between the die 1501A and 1501B. In another example embodiment,underfill material may be inserted as a liquid or paste, placed as afilm, or a b-staged film and may be placed sequentially as each die tosubstrate or die to die bond is made, or may be made all at one timeafter all the electrical bonds are made.

The thermal interface material 1511 may be utilized to provide a thermalconductive path for heat out of the die 1501A and 1501B. A heat spreader1523 may be placed above the thermal interface material 1511 to enablethe heat transfer away from the circuitry in the die 1501A and 1501B, asillustrated in FIG. 15E.

Furthermore, the solder balls 811 may be bonded to the back side pads819 on the packaging substrate 803. The solder balls 811 may be operableto provide electrical interconnects to external devices and circuitry,such as to a printed circuit board, for example. It is noted that whilesolder balls are shown in FIG. 15D, any metal interconnect may beutilized such as microbumps or copper pillars, for example.

FIG. 15E illustrates the resulting assembly in the die to packagesubstrate process, in accordance with an example embodiment of theinvention. As shown in FIG. 15E, a substrate 1525 may be bonded to thepackaging substrate 803 utilizing the solder balls 811 and the heatspreader 1523 may be placed over the die 1501B in contact with thethermal interface material 1511 and the over mold 1521. In addition, athermal interface material may be placed at the contact surface betweenthe heat spreader 1523 and the substrate 1525.

FIG. 16 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 16, there is shown a boat 1601, clips 1603, a plurality of die1605, an interposer 1607, and a substrate 1609. The boat 1601 maycomprise a rigid support structure in which a die/interposer assemblymay be placed and held in place by the clips 1603. The boat 1601 may becapable of withstanding high temperatures, above 200 C, for example.

The interposer 1607 may be bonded to the substrate 1609 utilizing athermal compression technique, for example. Similarly, the plurality ofdie 1605 may be bonded to the interposer 1607 via a thermal compressionbonding, technique, for example, prior to being placed in the boat 1601.As the temperature of the boat 1601, the plurality of die 1605 and theinterposer 1607 increases, the curvature of an assembly comprising theplurality of die 1605 and interposer 1607 may flatten with the clips1603 providing a downward force at the outer edges of the assembly. Asthe curvature approaches zero, the increased length in the lateraldirection may be accommodated by sliding under the clips 1603. Inaddition, the boat 1601 may provide mechanical support in conjunctionwith the downward force of the clips 1603, thereby planarizing theassembly.

The boat 1601 and clips 1603 may permit the partially assembled packageto heat up in normal fashion, but when that system has become flat, itresists the normal progression of the warpage, holding the partiallyassembled package to flatten during heating and then maintain thatflatness of the silicon interposer as temperatures climb higher.

FIG. 17 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 17, there is shown a boat 1701, a plurality of die 1705, aninterposer 1707, a substrate 1708, vacuum sealing rings 1709, vacuumchannels 1711, a valve 1713, and a vacuum supply 1715.

In an example scenario, the boat 1701 comprises a vacuum system toflatten the partially assembled package comprising the plurality of die1705, the interposer 1707, and the substrate 1708, which may comprise apackaging substrate, for example. The vacuum-mechanical system permitsthe partially assembled package to heat up in normal fashion, but whenthe partially assembled package has become flat, it resists the normalprogression of the warpage, holding the partially assembled package in aflattened configuration during heating and then maintains that flatnessof the silicon interposer 1707 and the substrate 1708 as temperaturesincreases.

The vacuum may be applied at room temperatures or slightly elevatedtemperatures utilizing the vacuum supply 1715 via the valve 1713 and thevacuum channels 1711, and may be held utilizing the high-temperaturesealing rings 1709 so that the vacuum-mechanical boat 1701 may travelthrough a standard reflow furnace and still maintain sufficient vacuumto maintain interposer silicon top surface planarity.

FIGS. 18A-18E illustrate steps for debonding wafers with large backsidebumps, in accordance with an example embodiment of the invention.Referring to FIG. 18A, there is shown a carrier wafer 1801, a devicewafer 1803 with backside bumps 1805, and a polymer layer 1807.

The device wafer 1803 may comprise an electronics (i.e. functional)wafer or an interposer wafer, for example, which may comprise largebackside bumps 1805 that may be susceptible to damage in debondprocesses. Accordingly, the polymer layer 1807 may be applied to protectthe backside bumps 1105 during debond processes. The polymer layer 1807may comprise a resist material or an adhesive film or tape, for example,that may be applied on the device wafer 1803 over the backside bumps1805.

A subsequent chuck attachment, such as with a vacuum technique, to thecarrier wafer 1801 and the top surface of the polymer layer 1807 isshown in FIG. 18B. The top chuck 1809A may be moved in one lateraldirection while the bottom chuck 1809B may be moved in the oppositedirection to separate the carrier wafer 1801 from the device wafer 1803.The polymer layer 1807 may enable a proper vacuum seal to the surface,where there may be a poor seal when applied directly to the backsidebumps 1805.

FIG. 18C shows the resulting structure following debond from the carrierwafer 1801. Any adhesive residue remaining from the carrier wafer 1801may be removed in a cleaning process while still attached to the topchuck 1809A.

The cleaned structure may then be affixed to a film frame 1811 with thebackside bumps 1805 facing up, as shown in FIG. 18D for example. Thepolymer layer 1807 may then be removed either chemically or thermallyfollowed by a surface clean, resulting in the bonded wafer 1803 shown inFIG. 18E for example.

FIG. 19 is a diagram illustrating die-to-die bonding utilizing apatterned underfill layer, in accordance with an embodiment of theinvention. Referring to FIG. 19, there is shown a top die 1901 withmicrobumps 1903 and a bottom die 1905 comprising contact pads 1907 andan underfill layer 1909.

In an example scenario, the microbumps 1903 may comprise copper pillars,for example, and may correspond to the contact pads 1907 in the bottomdie 1905. The underfill layer 1909 may comprise a polymer applied to thetop surface of the bottom die 1905 that the next level die, the top die1901, will be bonded to. The polymer may comprise a re-passivation orpre-applied underfill that will flow and bond to both die surfacesnegating the need for subsequent underfill processes.

Furthermore, the underfill layer 1909 may be patterned utilizingphotolithography techniques or laser ablation to expose the appropriatecontact pads 1907 in the bottom die 1905 (e.g., by forming wells in thelayer 1909). The layer 1909 may comprise a film where the openings maycomprise full depth pockets or partial depth pockets, for example,generated using laser ablation or photolithography techniques. Materialremaining in the partial depth pockets may assist in the bonding processof the top die 1901 to the bottom die 1905, for example.

The exposed pads may be utilized to align the top die 1901 to the bottomdie 1905. The die may be bonded utilizing a thermal compression or massreflow technique, for example. A flux dip may be utilized to aid inwetting of solder from one surface to the other and the underfill may“snap-cure” and seal to both top and bottom die surfaces. Furthermorethe underfill may flow around and under the microbumps 1903 and thecontact pads 1907 during the bond process.

In an example embodiment of the invention, a method and system aredisclosed for a semiconductor device package with a die-to-packingsubstrate first bond. For purposes of this example, the interposer 807of FIG. 8A-8B is termed a first die 807. In this regard, aspects of theinvention may comprise bonding a first die 807, 1501A (e.g., asemiconductor die) to a packaging substrate 803, applying an underfillmaterial 1101A, 1101B, 1503A between the first die 807, 1501A and thepackaging substrate 803, and bonding one or more additional die 801,1501B to the first die 807, 1501A.

The one or more additional die 801, 1501B may comprise electronicdevices. The first die 807, 1501A may be an interposer (as discussedabove) or may comprise electronic devices. The first die 807, 1501A maybe bonded to the packaging substrate 803 utilizing a mass reflow process1003A or a thermal compression process 1001B. The one or more additionaldie 801, 1501B may be bonded to the first die 807, 1501A utilizing amass reflow process 1003B or a thermal compression process 1001B, 1007B.The bonded first die and the bonded one or more additional die may beencapsulated in a mold material 1521. The mold material 1521 maycomprise a polymer. The one or more additional die 801, 1501B maycomprise micro-bumps 809 for coupling to the first die 807, 1501A.

The first die 107, 1501A may be an interposer (as discussed above)bonded to the packaging substrate 803 utilizing a thermal compressionprocess. The bonding of the one or more additional die 801, 1501B maycomprise: adhering the one or more additional die 801, 1501B to anadhesive layer; and bonding the adhered one or more additional die 801,1501B to the first die 807, 1501A.

The bonding of the one or more additional die 801, 1501B may comprise:placing the first die 807, 1501A and the packaging substrate in afixture that allows the first die 807, 1501A and the packaging substrateto flex in one direction but not in an opposite direction; andprocessing the first die 807, 1501A, the packaging substrate, and theone or more additional die 801, 1501B through a reflow process.

Prior to the bonding of the die 807, 1501A to the packaging substrate:thinning a first substrate 1310, which comprises the first die 807,1501A and is bonded to a support structure 1303, to exposethrough-silicon-vias 815 in said first die 807, 1501A; and removing thefirst interposer 1310 from the support structure 1303. The removing ofthe first substrate from the support structure 1303 may comprise:forming a protective, polymer layer 1807 over backside bumps 1805 on thefirst device wafer 1803; attaching a first chuck 1809A to the polymerlayer 1807; attaching a second chuck 1809B to the carrier wafer 1801;and causing relative motion between the attached first chuck 1809A andthe attached second chuck 1809B.

The bonded first die 807, 1501A and the bonded one or more additionaldie 801, 1501B may be encapsulated in a mold material 1521. The one ormore additional die 801, 1501B, 1901 may comprise micro-bumps 809, 1903for coupling to the first die 107, 1501A, 1905, wherein the bondingcomprises: positioning the micro-bumps 1903 in respective wells in alayer 1909 disposed on the first die 807, 1501A, 1905; and bonding themicro-bumps 1903 to the first die 807, 1501A.

Certain aspects of the invention may be found in a method and system fora semiconductor device package with a die-to-die first bond. Exampleaspects of the invention may comprise bonding one or more semiconductordie comprising electronic devices to an interposer die. An underfillmaterial may be applied between the one or more semiconductor die andthe interposer die, and a mold material may be applied to encapsulatethe one or more bonded semiconductor die. The interposer die may bethinned to expose through-silicon-vias (TSVs). Metal contacts may beapplied to the exposed TSVs, and the interposer die with the bonded oneor more semiconductor die may be bonded to a packaging substrate. Thebonding of the one or more semiconductor die may comprise: adhering theone or more semiconductor die to an adhesive layer; and bonding theadhered one or more semiconductor die to the interposer die. The one ormore semiconductor die may comprise micro-bumps for coupling to theinterposer die, where the bonding comprises positioning the micro-bumpsin respective wells in a layer disposed on the interposer die, andbonding the micro-bumps to the interposer die. The underfill materialmay be applied utilizing a capillary underfill process. The one or moresemiconductor die may be bonded to the interposer die utilizing a massreflow process or a thermal compression process. The one or moreadditional semiconductor die may be bonded to the one or moresemiconductor die utilizing a mass reflow process. One or moreadditional semiconductor die may be bonded to the one or moresemiconductor die utilizing a thermal compression process. The moldmaterial may comprise a polymer. The bonding of the one or moresemiconductor die may comprise placing the one or more semiconductor dieand the interposer die in a fixture that allows the one or moresemiconductor die and the interposer die to flex in one direction butnot in an opposite direction, and processing the one or moresemiconductor die and the interposer die through a reflow process.

FIG. 20A is a schematic illustrating an integrated circuit packageconfigured with a die-to-wafer first bond, in accordance with an exampleembodiment of the invention. Referring to FIG. 20A, there is shown apackage 2000 comprising integrated circuit die 2001, a packagingsubstrate 2003, passive devices 2005, an interposer die 2007, solderballs 2011, a lid 2013, and thermal interface material 2018.

The die 2001 may comprise integrated circuit die that have beenseparated from one or more semiconductor wafers. The die 2001 maycomprise electrical circuitry such as digital signal processors (DSPs),network processors, power management units, audio processors, RFcircuitry, wireless baseband system-on-chip (SoC) processors, sensors,and application specific integrated circuits, for example. In addition,the plurality of die 2001 may comprise micro-bumps 2009 for providingelectrical contact between the circuitry in the plurality of die 2001and contact pads on the surface of the interposer die 2007.

The interposer die 2007 may comprise a semiconductor die, such as asilicon die, with through-silicon-vias (TSVs) 2015 that provideelectrically conductive paths from one surface of the interposer die2007 to the opposite surface. The interposer die 2007 may also comprisebackside bumps 2017 for making electrical and mechanical contact to thepackaging substrate 2003. In another example scenario, the interposerdie 2007 may comprise glass or an organic laminate material, either ofwhich may be capable of large panel formats on the order of 500×500 mm,for example.

The packaging substrate 2003 may comprise a mechanical support structurefor the interposer die 2007, the die 2001, the passive devices 2005, andthe lid 2013. The packaging substrate 2003 may comprise solder balls2011 on the bottom surface for providing electrical contact to externaldevices and circuits, for example. The packaging substrate 2003 may alsocomprise conductive traces in a non-conductive material for providingconductive paths from the solder balls to the die 2001 via pads that areconfigured to receive the backside bumps 2017 on the interposer die2007. Additionally, the packaging substrate 2003 may comprise pads 2019for receiving the solder balls 2011. The pads 2019 may comprise one ormore under-bump metals, for example, for providing a proper electricaland mechanical contact between the packaging substrate 2003 and thesolder balls 2011.

The passive devices 2005 may comprise electrical devices such asresistors, capacitors, and inductors, for example, which may providefunctionality to devices and circuits in the die 2001. The passivedevices 2005 may comprise devices that may be difficult to integrate inthe integrated circuits in the die 2001, such as high value capacitorsor inductors. In another example scenario, the passive devices 2005 maycomprise one or more crystal oscillators for providing one or more clocksignals to the die 2001.

The lid 2013 may provide a hermetic seal for the devices within thecavity defined by the lid 2010 and the packaging substrate 2003. Athermal interface may be created for heat transfer out of the die 2001to the lid 2013 via the thermal interface material 2018, which may alsoact as an adhesive.

In an example scenario, the package 2000 may be fabricated by firstbonding the die 2001 to the interposer die 2007 when the interposer die2007 comprises an individual die, and may be bonded utilizing a massreflow or thermal compression process. In instances where the die 2001are bonded using a mass reflow process, backside bumps on the interposerdie 2007 might also be reflowed if present. Accordingly, the die 2001may be bonded to the interposer die 2007 before the 2017 backside bumpsare placed. The interposer die 2007 with attached die 2001 may beprocessed for further assembly. For example, the interposer die 2007 maybe thinned (e.g., before or after the above-mentioned die-bonding) toexpose the through-silicon-vias (TSVs) 2015, and the backside bumps 2017may be deposited. Furthermore, a capillary underfill material may beplaced between the die 2001 and the interposer die 2007 (e.g., in anexample scenario in which underfilling with a non-conductive pasteand/or tape is not performed during the bonding process) before a moldprocess is utilized to encapsulate the plurality of die 2001.

The assembly comprising the die 2001 and the interposer die 2007 may beprocessed as described above and the assembly may then be bonded to thepackaging substrate 2003, utilizing either a mass reflow or thermalcompression process, for example. The lid 2013 may be placed on thebonded assembly to provide a hermetic seal, to protect the circuitryfrom the external environment, and/or to serve as a heat sink. Finally,electrical tests may be performed following the bonding processes toverify that proper electrical connections were made and no shorts oropen circuits exist.

FIG. 20B is a schematic illustrating an integrated circuit packageconfigured with a die-to-die first bond and stacked die, in accordancewith an example embodiment of the invention. Referring to FIG. 20B,there is shown a package 2050 comprising the die 2001, the packagingsubstrate 2003, the passive devices 2005, the interposer die 2007, and astack of dynamic random access memory (DRAM) 2021. The die 2001, thepackaging substrate 2003, the passive devices 2005, and the interposerdie 2007 may be substantially as described with respect to FIG. 20A, forexample, but with different electrical connectivity for the differentdie 2001 and the stack of DRAM 2021.

The DRAM 2021 may comprise a stack of die for providing a high densitymemory for circuitry in the die 2001 or external to the package 2050.The DRAM 2021 may be stacked front-to-back and therefore comprise TSV'sfor providing electrical connectivity between the individual die.

In an example scenario, the package 2050 may be fabricated by firstbonding the die 2001 and the DRAM 2021 to the interposer die 2007 whenin die form. The die 2001 and the DRAM 2021 may be bonded utilizing amass reflow or thermal compression process. In an example scenario, thethermal compression process may utilize polymers, such as anisotropicfilms and/or conductive adhesives, for example.

In instances where the die 2001 and the stack of DRAM 2021 are bondedusing a mass reflow process, backside bumps on the interposer die 2007might also be reflowed if present at the time of the reflow process.Accordingly, the die 2001 and the stack of DRAM 2021 may be bonded tothe interposer die 2007 before the 2017 backside bumps are placed. Theinterposer die 2007 with attached die 2001 and the stack of DRAM 2021may be processed for further assembly. For example, the interposer die2007 may be thinned to expose the through-silicon-vias (TSVs) 2015, andthe backside bumps 2017 may be deposited. Furthermore, a capillaryunderfill material may be placed between the die 2001, the stack of DRAM2021, and the interposer die 2007 (e.g., in an example scenario in whichunderfilling with a non-conductive paste and/or tape is not performedduring the bonding process) before a mold process is utilized toencapsulate the die 2001 and stack of DRAM 2021.

Electrical tests may be performed following the bonding processes toverify that proper electrical connections were made and no shorts oropen circuits exist. Also, as described previously with regard to FIG.20A, the assembly may be bonded to the packaging substrate 2003 and thenovermolded and/or lidded.

FIGS. 20C-20E illustrate steps for bonding multiple die utilizing anadhesive film, in accordance with an example embodiment of theinvention. Referring to FIG. 20C, there is shown a plurality of die 2022and an adhesive layer 2029. The die 2022 may comprise metalinterconnects 2023 for subsequent bonding to other die. In anotherexample scenario, the metal interconnects 2023 may comprise microbumpsor copper pillars, for example.

The adhesive film 2029 may comprise an adhesive tape or compliant layer,for example, to which the die 2022 may be bonded, as illustrated in FIG.20C for example. The adhesive film 2029 may be a temporary adhesive forattaching multiple die to one or more other die, for example. Forexample, the interposer 2027 may comprise an individual interposer die.In an example scenario, the die 2022 may be placed temporarily on theadhesive film 2029.

An optional underfill material 2025 may also be placed on the interposer2027 as illustrated by underfill material 2025 in FIG. 20D, for example,before bonding the die 2022 to the interposer 2027 utilizing theadhesive film 2029. The underfill material 2025 may be used forsubsequent thermal compression bonding processes, for example, and mayallow instant underfill through a snap cure during a subsequent thermalcompression bonding process. This may improve bonding yields since asingle underfill process may be utilized for the plurality of die 2022as compared to a separate place and underfill process for each of thedie 2022 in a conventional process. The die 2022 may be placed face upso that the metal interconnects 2023 may be coupled to a receiving die.

The plurality of die 2022 on the adhesive film 2029 may then be placedon the interposer 2027, as shown in FIGS. 20D and 20E for example, wherethe initial placement of the die 2022 on the adhesive film 2029 mayenable fine control of the spacing and alignment of the die 2022 withthe interposer 2027. In an example scenario, the interposer 2027 may begang bonded to the die 2022. The interposer 2027 may comprise metal pads2031 for receiving the metal interconnects 2023. Once the die 2022 areplaced on the interposer 2027, a thermal compression bond process may beperformed for proper electrical and mechanical bonds between the metalinterconnects 2023 and the metal pads 2031. Once bonded, the adhesivefilm 2029 may be removed resulting in the structure shown in FIG. 20E.

FIGS. 21A-21F illustrate steps in a die-to-die first bond structure, inaccordance with an example embodiment of the invention. Referring toFIG. 21A, there is shown an interposer die 2101 and a plurality ofsemiconductor die 2103A and 2103B. The semiconductor die 2103A and 2103Bmay comprise integrated circuit die that have been separated from one ormore semiconductor wafers. The semiconductor die 2103A and 2103B maycomprise electrical circuitry such as digital signal processors (DSPs),network processors, power management units, audio processors, RFcircuitry, wireless baseband system-on-chip (SoC) processors, sensors,and application specific integrated circuits, for example.

In addition, the semiconductor die 2103A and 2103B may comprisemicro-bumps 2105 for providing electrical contact between the circuitryin the semiconductor die 2103A and 2103B and front side pads 2109 on thesurface of the interposer die 2101. While two die are shown in FIGS.21A-21F, the invention is not so limited, as any number of die may bebonded to the interposer die 2101 dependent on chip area.

The interposer die 2101 may comprise front side pads 2109 for providingelectrical contact to the semiconductor die 2103A and 2103B.Furthermore, the interposer die 2101 may comprise through-silicon-vias(TSVs) 2107 for providing electrically conductive paths from one surfaceof the interposer to the other, for example, once the interposer die2101 has been thinned.

The semiconductor die 2103A and 2103B may be placed on the interposerdie 2101 and bonded using a thermal compression bonding technique, forexample. In another example scenario, a mass reflow process may beutilized to bond the semiconductor die 2103A and 2103B. A non-conductivepaste (NCP) may also be utilized to assist in forming the bonds. Inaddition, a capillary underfill may then be applied and may fill thevolume between the semiconductor die 2103A and 2103B and the interposerdie 2101. FIG. 21B illustrates the semiconductor die 2103A and 2103Bbonded to the interposer die 2101 with underfill material 2110. Whendeposited or placed, the underfill material 2110 may comprise a film,paste, b-stage film, or a liquid, for example.

The space between and/or around the respective perimeters of thesemiconductor die 2103A and 2103B may be filled with a mold material2111, as illustrated in FIG. 21C for example. The mold material 2111 maycomprise a polymer material, for example, that may provide anon-conductive structural support for die bonded to the interposer die2101, protecting the die in subsequent processing steps. Note that themold material 2111, in various example scenarios, may cover the top ofone or more of the semiconductor die 2103A and 2103B. In an examplescenario, the interposer die 2101 may be thinned utilizing a back sidepolish or grind, for example, to expose the TSVs 2107.

While the underfill material 2110 is shown in FIGS. 21B-21F, the moldmaterial itself may be utilized as underfill material for each couplinginterface, such as between the die 2103A and 2103B and the interposerdie 2101. In another example embodiment, underfill material may beinserted as a liquid or paste, placed as a film, or a b-staged film andmay be placed sequentially as each die to substrate or die to die bondis made, or may be made all at one time after all the electrical bondsare made.

In another example scenario, the interposer die 2101 may be thinned to athickness where the TSVs are still slightly covered, which may then beetched selectively in areas covering the TSVs. A protective layer maythen be deposited over the remaining silicon and a polish of the exposedmetal may be performed for improved contact to the TSVs 2107.Additionally, metal pads may be deposited on the polished TSV surfacesfor better contact with the backside bumps 2113.

In another example scenario, the interposer die 2101 may already bethinned and comprise the backside bumps 2113 prior to receiving thesemiconductor die 2103A and 2103B. In this case, structural supports,adhesive films, and film frames, such as is illustrated in FIGS.25A-25E, for example, may be utilized to process the interposer die2101.

After the interposer die 2101 has been thinned, the backside bumps 2113may be deposited, as shown in FIG. 21D, for making contact between theTSVs 2107 and subsequently bonded substrates, such as, for example,packaging substrates.

The assembly comprising the semiconductor die 2103A and 2103B and theinterposer die 2101 may then be bonded to the packaging substrate 2115via the backside bumps 2113, as illustrated in FIG. 21E. The packagingsubstrate 2115 may comprise a mechanical support structure for dieassemblies and may also support passive devices and a lid, for example.The packaging substrate 2115 may comprise contact pads 2119 for makingcontact with the backside bumps 2113 on the interposer die 2101 and alsofor subsequent placement of solder balls 2027 (or alternativestructures) as shown in FIG. 21F.

In addition, the lid 2123 may be placed on the package assembly with ahermetic seal made with an adhesive 2125 at the surface of the packagingsubstrate 2115, which may also comprise a thermal interface material.Accordingly, the lid 2121 may make contact with the top surfaces of thesemiconductor die 2103A and 2103B (e.g., directly or through a thermalinterface material) for thermal heat sinking purposes. The solder balls2127 may comprise metal spheres for making electrical and mechanicalcontact with a printed circuit board, for example.

FIG. 22 is a schematic illustrating steps in a die-to-die first bondprocess, in accordance with an example embodiment of the invention.Referring to FIG. 22, there is shown a die-to-die process beginning witha die to interposer die attach step 2201. The one or more die may bebonded utilizing a thermal compression bonding technique or a massreflow process, for example. In the example shown in FIG. 22, a massreflow process is utilized. Additional die may also be bonded to thefirst bonded die, such as illustrated by the DRAM stack 2021 shown inFIG. 20B, or the interposer wafer as shown in FIG. 20A.

After the die are placed on the interposer die, the assembly may then besubjected to a reflow process 2203A, where the assembly may be heated toprovide a suitable electrical and mechanical connection between metalinterconnects. An underfill process 2205A may be utilized following thebonding process (e.g., in an example scenario in which underfilling didnot occur during the bonding process), which may provide an insulatingbarrier between contacts and may fill the volume between the die and theinterposer wafer.

A molding step 2207 may then be utilized to package the die/interposerassembly, for example, before thinning the interposer die to expose theTSVs in the backside finish step 2209. In addition, backside contactsmay be applied to the exposed TSVs in the interposer wafer (e.g., in anexample scenario in which such contacts had not been previously formed).

Once the backside contacts are placed, the assembly may be attached to apackaging substrate in the attach die stack to substrate step 2211. Thismay be followed by a second reflow step 2203B for creating properelectrical and mechanical bonds to the packaging substrate and anunderfill step 2205B for filling the volume between the die andinterposer assembly and the packaging substrate. Finally, the bondedpackage may be subjected to a final test step 2213 for assessing theperformance of the electronic circuitry in the bonded die and to testthe electrical contacts made in the bonding processes.

FIG. 23 is a diagram illustrating a mechanical planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 23, there is shown a boat 2301, clips 2303, a plurality ofsemiconductor die 2305, and an interposer 2307, where the interposer2307 may be in die form. The boat 2301 may comprise a rigid supportstructure, or fixture, in which a die/interposer assembly may be placedand held in place by the clips 2303. The boat 2301 may be capable ofwithstanding high temperatures, above 200 C, for example used forprocessing the die/interposer assembly.

The plurality of semiconductor die 2305 may be bonded to the interposer2307, when in die form, via a thermal compression bonding, technique,for example, prior to being placed in the boat 2301. As the temperatureof the boat 2301, the plurality of semiconductor die 2305, and theinterposer 2307 increases, the curvature of an assembly comprising theplurality of semiconductor die 2305 and the interposer 2307 may flattenwith the clips 2303 providing a downward force at the outer edges of theassembly. As the curvature approaches zero, the increased length in thelateral direction may be accommodated by the sliding of the assemblyunder the clips 2303. In addition, the boat 2301 provides mechanicalsupport in conjunction with the downward force of the clips 2303,thereby planarizing the assembly.

The boat 2301 and clips 2303 may permit the partially assembled packageto heat up in normal fashion, but when the die/interposer assembly hasbecome flat with increased temperature, the boat 2301 and clips 2303resist the normal progression of the warpage, holding the partiallyassembled package, flattening it during heating and then maintainingthat flatness of the silicon interposer as temperatures climb higher.

FIG. 24 is a diagram illustrating a vacuum planarizing apparatus, inaccordance with an example embodiment of the invention. Referring toFIG. 24, there is shown a boat 2401, a plurality of semiconductor die2405, an interposer 2407, vacuum sealing rings 2409, vacuum channels2411, a valve 2413, and a vacuum supply 2415.

In an example scenario, the boat 2401 may comprise a vacuum system, orfixture, to flatten the partially assembled package comprising theplurality of semiconductor die 2405 and the interposer 2407 when in dieform. The vacuum-mechanical system permits the partially assembledpackage to heat up in normal fashion, but when the partially assembledpackage has become flat, the vacuum-mechanical system resists the normalprogression of the warpage, holding the partially assembled package in aflattened configuration during heating and then maintains that flatnessof the silicon interposer die 2407 as temperatures increases.

The vacuum may be applied at room temperature or slightly elevatedtemperatures utilizing the vacuum supply 2415 via the valve 2413 and thevacuum channels 2411, and may be held utilizing the high-temperaturesealing rings 2409 so that the vacuum-mechanical boat 2401 may travelthrough a standard reflow furnace and still maintain a sufficient vacuumto maintain interposer silicon top surface planarity.

FIGS. 25A-25E illustrate example steps for debonding wafers with largebackside bumps, in accordance with an example embodiment of theinvention. Referring to FIG. 25A, there is show a carrier wafer 2501, awafer 2503 with backside bumps 2505, and a polymer layer 2507.

The wafer 2503 may comprise an electronics wafer or an interposer wafer,for example, which may comprise large backside bumps 2505 that may besusceptible to damage in debond processes. Accordingly, the polymerlayer 2507 may be applied to protect the backside bumps 2505 duringdebond processes. The polymer layer 2507 may comprise a resist materialor an adhesive film or tape, for example, which may be applied on thedevice wafer 2503 over the backside bumps 2505. While wafers are shownin FIG. 25A, the technique may also be utilized on die.

A subsequent chuck attachment, such as with a vacuum technique, to thecarrier wafer 2501 and the top surface of the polymer layer 2507 isshown in FIG. 25B. The top chuck 2509A may be moved in one lateraldirection while the bottom chuck 2509B may be moved in the oppositedirection to separate the carrier wafer 2501 from the wafer 2503. Thepolymer layer 2507 may enable a proper vacuum seal to the surface, wherethere may be a poor seal when applied directly to the backside bumps2505.

FIG. 25C shows a resulting structure following debond from the carrierwafer 2501. Any adhesive residue remaining from the carrier wafer 2501may be removed in a cleaning process while still attached to the topchuck 2509A.

The cleaned structure may then be affixed to a film frame 2511 with thebackside bumps 2505 facing up and being detached from the top chuck2509A, as shown in FIG. 25D. The polymer layer 2507 may then be removedeither chemically or thermally, and thereafter may undergo a surfaceclean, resulting in the bonded wafer 2503 shown in FIG. 25E, forexample. The film frame 2511 may enable further processing and ease oftransport for the bonded wafer 2503.

FIG. 26 is a diagram illustrating die bonding utilizing a patternedunderfill layer, in accordance with an example embodiment of theinvention. Referring to FIG. 26, there is shown a top semiconductor die2601 with microbumps 2603 and a bottom semiconductor die 2605 comprisingcontact pads 2607 and an underfill layer 2609.

In an example scenario, the microbumps 2603 may comprise copper pillars,for example, and may correspond to the contact pads 2607 in the bottomsemiconductor die 2605. Although the bottom semiconductor die 2605 isshown as a single die, in another example scenario, it may comprise anentire wafer of die (e.g., an interposer wafer), with a plurality of topsemiconductor die 2601 being bonded to the wafer as opposed to a singledie. In an example scenario, the bottom semiconductor die 2605 comprisesa single interposer die. The underfill layer 2609 may comprise a polymerapplied to the top surface of the bottom semiconductor die 2605 to whichthe next level die, e.g., the top semiconductor die 2601, will bebonded. The polymer may comprise a re-passivation or pre-appliedunderfill that will flow and bond to both die surfaces negating the needfor subsequent underfill processes.

Furthermore, the underfill layer 2609 may be patterned utilizingphotolithography techniques or laser ablation to create the wells 2611thereby exposing the appropriate contact pads 2607 in the bottomsemiconductor die 2605, for example by forming wells in the underfilllayer 2609. The underfill layer 2609 may comprise a film where theopenings may comprise full depth pockets or partial depth pockets, forexample, generated using laser ablation or photolithography techniques.Material remaining in the partial depth pockets may assist in thebonding process of the top die 2601 to the bottom die 2605, for example.

The exposed pads may be utilized to align the top semiconductor die 2601to the bottom semiconductor die 2605. The die may be bonded utilizing athermal compression or mass reflow technique, for example. A flux dipmay be utilized to aid in wetting of solder from one surface to theother and the underfill may “snap-cure” and seal both to the top andbottom die surfaces. Furthermore, the underfill may flow around andunder the microbumps 2603 and the contact pads 2607 during the bondprocess.

In an example embodiment of the invention, methods are disclosed for asemiconductor device package with a die-to-die first bond. In thisregard, aspects of the invention may comprise bonding one or moresemiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 comprisingelectronic devices to an interposer die 2007, 2101. An underfillmaterial 2110 may be applied between the one or more semiconductor die2001, 2021, 2103A, 2103B, 2305, 2405, 2601 and the interposer die 2007,2101, and a mold material 2111 may be applied to encapsulate the one ormore bonded semiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405,2601. The interposer die 2007, 2101, and 2605 in instances where thebottom semiconductor die 2605 comprises an interposer die, may bethinned to expose through-silicon-vias (TSVs) 2015, 2107. Metal contacts2113 may be applied to the exposed TSVs 2015, 2107 and the interposerdie 2007, 2101, and 2605 in instances where the bottom semiconductor die2605 comprises an interposer die, with the bonded one or moresemiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 be bondedmay to a packaging substrate 2003, 2115.

The bonding of the one or more semiconductor die 2001, 2021, 2103A,2103B, 2305, 2405, 2601 may comprise: adhering the one or moresemiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 to anadhesive layer 2511; and bonding the adhered one or more semiconductordie 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 to the interposer die2007, 2101, and 2605 in instances where the bottom semiconductor die2605 comprises an interposer die. The one or more semiconductor die2001, 2021, 2103A, 2103B, 2305, 2405, 2601 may comprise micro-bumps2009, 2105, 2603 for coupling to the interposer die 2007, 2101, and 2605in instances where the bottom semiconductor die 2605 comprises aninterposer die, wherein the bonding comprises: positioning themicro-bumps 2009, 2105, 2603 in respective wells 2611 in a layer 2609disposed on the interposer die 2007, 2101, and 2605 in instances wherethe bottom semiconductor die 2605 comprises an interposer die, andbonding the micro-bumps 2009, 2105, 2603 to the interposer die 2007,2101, and 2605 in instances where the bottom semiconductor die 2605comprises an interposer die. The underfill material 2110 may be appliedutilizing a capillary underfill process. The one or more semiconductordie may 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 be bonded to theinterposer die 2007, 2101, and 2605 in instances where the bottomsemiconductor die 2605 comprises an interposer die, utilizing a massreflow process or a thermal compression process.

One or more additional semiconductor die 2121, 2601 may be bonded to theone or more semiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601utilizing a mass reflow process. The one or more additionalsemiconductor die 2021, 2601 may be bonded to the one or moresemiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 utilizing athermal compression process. The mold material 2111 may comprise apolymer. The bonding of the one or more semiconductor die 2001, 2021,2103A, 2103B, 2305, 2405, 2601 may comprise: placing the one or moresemiconductor die 2001, 2021, 2103A, 2103B, 2305, 2405, 2601 and theinterposer die 2007, 2101, and 2605 in instances where the bottomsemiconductor die 2605 comprises an interposer die, in a fixture 2301,2401 that allows the one or more semiconductor die and the interposerdie 2007, 2101, and 2605 in instances where the bottom semiconductor die2605 comprises an interposer die, to flex in one direction but not in anopposite direction; and processing the one or more semiconductor die2001, 2021, 2103A, 2103B, 2305, 2405, 2601 and the interposer die 2007,2101, and 2605 in instances where the bottom semiconductor die 2605comprises an interposer die, through a reflow process.

While the invention has been described with reference to certainembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted withoutdeparting from the scope of the present invention. In addition, manymodifications may be made to adapt a particular situation or material tothe teachings of the present invention without departing from its scope.Therefore, it is intended that the present invention not be limited tothe particular embodiments disclosed, but that the present inventionwill include all embodiments falling within the scope of the appendedclaims.

What is claimed is:
 1. A method for making a semiconductor package, themethod comprising: receiving a package substrate comprising: a topsubstrate side comprising top pads; a bottom substrate side comprisingbottom pads; and conductive paths connecting the top pads and the bottompads; receiving an interposer array comprising a plurality of interposerdies, each of the plurality of interposer dies comprising an interposerdie top side, an interposer die bottom side, and a plurality ofinterposer die conductive paths from the interposer die top side to theinterposer die bottom side; bonding a plurality of device dies to theinterposer array, wherein each of the plurality of device dies comprisesan electronic device; after said bonding the plurality of device dies:singulating the interposer array into a plurality of singulatedinterposer dies comprising a first singulated interposer die having afirst device die and a second device die of the plurality of device diesthat are bonded to the interposer die top side of the first singulatedinterposer die, and that are surrounded by a perimeter of the interposerdie top side; and bonding and electrically connecting the first devicedie and the second device die to the package substrate by bonding andelectrically connecting the first singulated interposer die to the toppads of the package substrate.
 2. The method of claim 1, wherein theinterposer array comprises an interposer wafer.
 3. The method of claim1, wherein said bonding the plurality of device dies to the interposerarray comprises: bonding, to the interposer array, a plurality ofstacked device dies that include a first stack comprising the firstdevice die; and bonding, to the interposer array, a plurality ofnon-stacked device dies that include the second device die such that thesecond device die is at a position laterally displaced from the firstdevice die of the first stack.
 4. The method of claim 1, wherein theplurality of interposer dies of the interposer array do not comprise anyelectronic devices.
 5. The method of claim 1, comprising applying afirst underfill material over the interposer array before bonding theplurality of device dies to the interposer array; and applying secondunderfill material between the first singulated interposer die and thetop substrate side.
 6. The method of claim 1, comprising bonding a heatsink to the top substrate side, wherein the heat sink laterallysurrounds the first singulated interposer die.
 7. The method of claim 1,wherein the interposer die conductive paths comprise through siliconvias.
 8. A method for making a semiconductor package, the methodcomprising: receiving a package substrate comprising: a top substrateside comprising a top pad; a bottom substrate side comprising a bottompad; and a conductive path connecting the top pad and the bottom pad;receiving an interposer array comprising a plurality of interposer dies,each of the plurality of interposer dies comprising an interposer dietop side, an interposer die bottom side, and a plurality of interposerdie conductive paths from the interposer die top side to the interposerdie bottom side; applying an underfill material to the interposer array;bonding a plurality of device dies to the respective interposer die topside of each of the plurality of interposer dies, wherein the underfillmaterial traverses the plurality of device dies on the interposer dietop side, and wherein each of the device dies comprises an electronicdevice; encapsulating the bonded device dies and the interposer die topsides of the interposer dies in an encapsulating material; singulatingthe encapsulated bonded device dies and interposer dies into a pluralityof singulated components; and bonding and electrically connecting afirst singulated component of the plurality of singulated components tothe top pad of the package substrate.
 9. The method of claim 8, whereinsaid bonding the plurality of device dies to the respective interposerdie top side of each of the plurality of interposer dies comprises:bonding a stack of stacked dies comprising a first die; and bonding anon-stacked second device die at a position laterally displaced from thestack.
 10. The method of claim 8, wherein the plurality of interposerdies of the interposer array do not comprise any electronic devices. 11.The method of claim 8, wherein a respective top side of each of thedevice dies bonded to each of the plurality of interposer dies isexposed from the encapsulating material.
 12. The method of claim 8,wherein the interposer array comprises silicon.
 13. The method of claim8, wherein the interposer die conductive paths comprise through-siliconvias.
 14. The method of claim 11, comprising: depositing thermalinterface material to the respective top side of a first device die ofthe device dies; and bonding a heat sink to the top substrate side suchthat the heat sink laterally surrounds the first singulated componentand is attached to the respective top side of the first device die viathe thermal interface material.
 15. A method for making a semiconductorpackage, the method comprising: receiving a package substratecomprising: a top substrate side comprising a top pad; a bottomsubstrate side comprising a bottom pad; and a conductive path connectingthe top pad and the bottom pad; receiving an interposer array comprisinga plurality of interposer dies, each of the plurality of interposer diescomprising an interposer die top side, an interposer die bottom side,and a plurality of interposer die conductive paths from the interposerdie top side toward the interposer die bottom side; thinning theinterposer array to expose the interposer die conductive paths; forminga conductive bump on each of the exposed interposer die conductivepaths; after said forming the conductive bump, bonding one or moredevice dies to the respective top side of each of the plurality ofinterposer dies, wherein each of the one or more device dies comprisesan electronic device; and after said bonding the the one or more devicedies: singulating the thinned interposer array comprising the pluralityof interposer dies into a plurality of singulated interposer diescomprising a first singulated interposer die; and bonding andelectrically connecting the first singulated interposer die to the toppad of the package substrate.
 16. The method of claim 15, comprisingprior to said singulating the thinned interposer array, encapsulatingthe bonded device dies and the interposer die top sides of theinterposer dies in an encapsulating material.
 17. The method of claim15, comprising bonding a heat sink to the top substrate side, whereinthe heat sink laterally surrounds the first singulated interposer die.18. The method of claim 17, wherein the heat sink covers a top side ofeach of the respective device dies bonded to the first singulatedinterposer die.
 19. The method of claim 16, wherein said encapsulatingthe bonded device dies comprises encapsulating the bonded device diessuch that a top side of the bonded device dies is exposed through theencapsulating material.
 20. The method of claim 19, further comprisingdepositing thermal interface material to the respective top side of afirst device die of the one or more device dies; and bonding a heat sinkto the top substrate side such that the heat sink laterally surroundsthe first singulated interposer die and is attached to the respectivetop side of the first device die via the thermal interface material.